Technologies
Our Expertise for your Products
Our ability to ensure quick, reliable, flexible and uncomplicated implementations of new ideas rests on our broad range of production technologies, state-of-the-art facilities and detailed process knowledge.
We provide unmatched foundation of knowledge and experience, seamless integration from design to fabrication, and Technologies unique in the MEMS world. Our ability to ensure quick, reliable, flexible and uncomplicated implementations of new ideas rests on our broad range of production technologies, state-of-the-art facilities and detailed process knowledge.
How can microFAB help
microfab applies well established technologies for wafer processing and manufacturing of customer-based MEMS/microsystems, such as bulk micromachining including deep trench silicon etch DRIE, surface micromachining based on stress-controlled LPCVD layers, wafer bonding (anodic and silicon direct) or electroplating of gold and other metals and alloys.
- Bulk micromachining
- Advanced bulk micromachining by Deep Reactive Ion Etching DRIE (Bosch Process)Surface micromachining
- based on stress-controlled poly Si and sacrificial layer etch
- Surface treatment with Nanofilms
Standard processes
With following link you will find a representative listing of the wide variety of standard processes we offer. For more information on any of these processes, please feel free to contact us.
List of standard processes [190 KB]