Chip to Enviroment
C2E for Customerīs Needs
With the C2E solutions platform, microFAB Bremen offers a new and innovative technology for assembly of MEMS components to the outside world.
The large variety of MEMS components requires dedicated packaging solutions tailored to the specific MEMS application.
Trough wafer contacts
The C2E solutions platform offers the packaging on wafer level, independent of starting conditions and application area in order to meet the standard packaging tasks such as interconnection and capping of encapsulation. MEMS components assembled using the C2E solutions platform can be used without further intermediate processing step.
