C2Eopto
Optoelectronic MEMS components often require transparent materials as an integral part of the capped or encapsulated system. The C2Eopto technology targets such applications by solving difficult tasks of electrical interconnection in combination with hermetic or semi-hermetic sealing. Borofloat or silica glass as the used material can be adjusted to customer requirements in terms of optical property.
Innovative and new solutions for customized MEMS devices can be an attractive and cost-effective alternative with the new C2Esolutions packaging concept by microFAB Bremen GmbH.
