C2Edirect
For existing MEMS devices on a bulk wafer not fabricated by microFAB , the C2Edirect solution offers the interconnect technology in a post processing route at microFAB. Integral part of this add-on technology is the direct interconnection to other components avoiding the need for subsequent wire bonding. Whereever short-distance interfacing is mandatory for proper functioning of the MEMS system, the C2Edirect solution is close at hand.
Innovative and new solutions for customized MEMS devices can be an attractive and cost-effective alternative with the new C2Esolutions packaging concept by microFAB Bremen GmbH.
