C2Ecap
Whenever a MEMS component requires special protection to the outside enviroment or a defined working atmosphere, the C2Ecap solution is the right choice. Encapsulation and interconnection of delicate devices in a multi-stack assembly is possible.
Innovative and new solutions for customized MEMS devices can be an attractive and cost-effective alternative with the new C2Esolutions packaging concept by microFAB Bremen GmbH.
