C2Esub
C2Esub offers a solution for MEMS device fabricated at microFAB on the same substrate wafer used for the following Packaging. The substrate includes the necessary through-wafer interconnects as well as under-bump or bump metallization. C2Esub can also be used as an intermediary between specific MEMS devices and microelectronic components such as signal processing ASICs.
Innovative and new solutions for customized MEMS devices can be an attractive and cost-effective alternative with the new C2Esolutions packaging concept by microFAB Bremen GmbH.
