Back end

Back end processes

For prototyping and small series production microfab offers Back end services as following. For larger numbers microfab recommend to outsource services to one of our Packaging Partners.

wafer dicing
microfab
back end services An automatic wafer dicing machine allows the separation of different materials such as silicon, glas or ceramic. Substrate dimensions up to 150mm of diameter and thicknesses up to 2mm can be diced.

die bonding
An epoxy die bonder allows to apply different glue materials, soldering and glas pastes which can be dispensed precisely. The possibility to position the die accurately to a carrier or socket is given as well. A preform/die attach machine allows the use of different preform materials for soldering and eutectic die attachment.

wire bonding
microfab
offers two different possibilities for wire bonding: Ball-Wedge and Wedge-Wedge bonding with different wires. Gold and aluminium wires are used in a diameter range from 25µm to 50µm. Quality control of bond connections can be done by a pulltest machine.

For larger numbers microfab recommend to outsource services to one of our Packaging Partners.



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